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  Datasheet File OCR Text:
 1N6478 thru 1N6484
Vishay Semiconductors
formerly General Semiconductor
Surface Mount Glass Passivated Junction Rectifiers
(R)
Rev. Voltage 50 to 1000V Forward Current 1.0A
DO-213AB
SOLDERABLE ENDS 1st BAND
0 D2 = D1 + 0.008 (0.20) -
ted* aten P
Features
* Plastic package has Underwriters Laboratories Flammability Classification 94V-0 * For surface mount applications * High temperature metallurgically bonded construction * Cavity-free glass passivated junction * Capable of meeting environmental standards of MIL-S-19500 * High temperature soldering guaranteed: 450C/5 seconds at terminals. Complete device sub-mersible temperature of 265C for 10 seconds in solder bath
D2
D1= 0.105 0.095 (2.67) (2.41)
Mechanical Data
Case: JEDEC DO-213AB, molded plastic over glass body Terminals: Plated terminals, solderable per MIL-STD-750, Method 2026 Polarity: Two bands indicate cathode end - 1st band denotes device type and 2nd band denotes repetitive peak reverse voltage rating Mounting Position: Any Weight: 0.0046 oz., 0.116 g
Ratings at 25C ambient temperature unless otherwise specified.
0.022 (0.56) 0.018 (0.46) 0.205 (5.2) 0.185(4.7) 1st band denotes type and positive end (cathode)
0.022 (0.56) 0.018 (0.46)
Dimensions in inches and (millimeters)
*Glass-plastic encapsulation is covered by
Patent No. 3,996,602 and brazed-lead assembly to Patent No. 3,930,306
Maximum Ratings & Thermal Characteristics
Standard recovery time device: 1st band is White Polarity color bands (2nd Band) * Maximum repetitive peak reverse voltage Maximum RMS voltage * Maximum DC blocking voltage * Maximum average forward rectified current * Peak forward surge current 8.3ms single half sine-wave superimposed on rated load at TA=75C (JEDEC Method) * Maximum full load reverse current, full cycle average at TA = 75C * Maximum thermal resistance (Note 1)
(Note 2)
Symbol 1N6478 1N6479 1N6480 1N6481 1N6482 1N6483 1N6484 Unit Gray VRRM VRMS VDC IF(AV) IFSM IR(AV) RJA RJT TJ, TSTG 50 35 50 Red 100 70 100 Orange Yellow Green 200 140 200 400 280 400 1.0 30 100 50 20 -65 to +175 600 420 600 Blue 800 560 800 Violet 1000 700 1000 V V V A A A C/W C
* Operating junction and storage temperature range
Electrical Characteristics
* Maximum instantaneous forward voltage at 1.0A * Maximum DC reverse current at rated DC blocking voltage
Ratings at 25C ambient temperature unless otherwise specified.
TA = 25C TA = 75C TA = 25C TA = 125C
VF IR CJ
1.1 1.0 10 200 8.0
V A pF
* Typical junction capacitance at 4.0V, 1MHz
Notes: (1) Thermal resistance from junction to ambient, 0.24 x 0.24" (6.0 x 6.0mm) copper pads to each terminal (2) Thermal resistance from junction to terminal, 0.24 x 0.24" (6.0 x 6.0mm) copper pads to each terminal *JEDEC Registered Values
Document Number 88527 14-Feb-02
www.vishay.com 1
1N6478 thru 1N6484
Vishay Semiconductors
formerly General Semiconductor
Ratings and Characteristic Curves (TA = 25C unless otherwise noted)
Fig. 1 - Forward Current Derating Curve
1.0
Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current
30
Peak Forward Surge Current (A)
Average Forward Current (A)
0.8
60Hz Resistive or Inductive Load
25 20
TA = 75C 8.3ms Single Half Sine Wave (JEDEC Method)
0.6
15
0.4
10 5.0 0
0.2
0
0
25
50
75
100
125
150
175
1
10
100
Terminal Temperature (C)
Number of Cycles at 60HZ
Fig. 3 - Typical Instantaneous Forward Characteristics
10 10
Fig. 4 - Typical Reverse Characteristics
Instantaneous Reverse Current (mA)
Instantaneous Forward Current (A)
1.0
Pulse Width = 300s 1% Duty Cycle
TJ = 100C 1.0
TJ = 25C 0.1
0.1 TJ = 25C
0.01 0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.01 0
20
40
60
80
100
Instantaneous Forward Voltage (V)
Percent of Rated Peak Reverse Voltage (%)
Fig. 5 - Typical Junction Capacitance
30
Fig. 6 - Typical Transient Thermal Impedance
100
10
Transient Thermal Impedance (C/W)
Junction Capacitance (pF)
TJ = 25C f = 1.0MHZ Vsig = 50mVp-p
Mounted on 0.20 x 0.27" (5 x 7mm) Copper Pad Areas
10
1
1 1 10 100
0.1 0.01
0.1
1
10
100
Reverse Voltage (V) www.vishay.com 2
t -- Pulse Duration (sec.) Document Number 88527 14-Feb-02


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